CoorsTek’ high-purity graphite products, which have unique properties compared with metal materials and other ceramic materials, are used in a variety of industries, including semiconductors. In particular, our high-purity graphite materials, which contain less than 3 ppm of ash, are widely used in heaters and crucibles for pulling single crystal silicon and boats for liquid-phase epitaxial growth in the semiconductor manufacturing processes. In addition, CLEAR CARBON, composed of an SiC film coated on a high-purity graphite substrate, has earned a reputation for excellent quality worldwide as susceptors for epitaxial growth and other jigs.
SiC anchored deeply in the surface layer of graphite substrate; it provides CLEAR CARBONwith strong adhesion of SiC to Graphite substrate
Product name | Gas | Process temperature (![]() |
|||||
---|---|---|---|---|---|---|---|
1300 | 1350 | 1400 | 1450 | 1500 | 1550 | ||
CLEAR CARBON | H2 | ![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
H2+HCI | ![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
|
Conventional CVD-Sic coating | H2 | ![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
H2+HCI | ![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
Normal surface (non surface finish)
Surface finish 1
Surface finish 2
CLEAR CARBON is used in wide range of semiconductor manufacturing processes,
e.g., Epitaxial growth, MO-CVD, etc.
SiC coating film | |
---|---|
Structure | ![]() |
Bulk Density | 3.2 |
Bending Strength | 500MPa |
Thermal conductivity | 200W/mK |
Emissivity (650![]() |
76% |
Coefficient of Thermal (25-1200![]() |
4.4![]() ![]() |
Graphite Substrate (AP70) | |
---|---|
Bulk Density | 1.88g/cm3 |
Open Porosity | 10% |
Shore Hardness | 60 |
Specific Resistance | 11![]() |
Bending Strength | 45MPa |
Young's Modulus | 13.5GPa |
Thermal Conductivity | 107W/mK |
Coefficient of Thermal Expansion | 4.8![]() |
Accelerated test for oxidation rate (Typical data)
Graphite Substrate (AP70) | |
---|---|
Bulk Density | 1.88g/cm3 |
Open Porosity | 10% |
Shore Hardness | 60 |
Specific Resistance | 11![]() |
Bending Strength | 45MPa |
Young's Modulus | 13.5GPa |
Thermal Conductivity | 107W/mK |
Coefficient of Thermal Expansion (0-450![]() |
4.8![]() |