CERASIC Atmospheric Pressure Sintered SiC

New products of CERASIC

Semiconductor Related Products

CERASIC, a silicon carbide material sintered under atmospheric pressure, is an ideal material for machine parts that require not only high thermal strength, but also abrasion and corrosion resistance. A range of applications in the semiconductor and FPDs manufacturing process have been developed for this material. In addition, ultra high purity products with a CVD coating are available.


Material for Silicon wafers : Forks, Laping plate, Stage materials, Susceptors, Chucks, Mirrors
Materials for producing FPDs: Large-scale chucks, Sliders

Image of CMP Plates

Temperature controllable polishing table

Image of CERASIC Forks and Plates

CERASIC Lapping Plate

Image of CERASIC Lapping Plate

CERASIC Forks and Plates

CERASIC Properties (Typical Data)

Bulk density (d) g/cm3 3.1
Bending strength (R.T) MPa 450
(1450℃) MPa 450
Young's modulus (E) GPa 420
Poisson's ratio   0.18
Shear modulus (E/d) 106m 12.6
Vickers hardness   2300
Fracture toughness (KIC) MPa・m1/2 3.5
Coefficient of thermal expension   10-6/K 4.5
Thermal conductivity (lamba) W/mk 170
Thermal diffusivity (lamba/cd) cm2/s 0.8
Thermal shock resistance (△T) degree 450
Electrical conductivity (R.T) omega·cm ×100-106

Page Top