High-purity silicon parts, which have the same degree of purity as silicon wafers, generate almost no contamination and considerably fewer particles. Although the standard product is manufactured in a plate shape, it can also be produced as a rod or a ring. Furthermore, high-precision machining that was once considered difficult when producing parts is now possible. Therefore, there are great expectations regarding its application in various processes.
High-Purity Silicon Parts
Size | Type | Typical resistivity | Oxygen density |
---|---|---|---|
(·cm) | (1018 atoms/cm3) | ||
200XL | P/N | 1-20 | 0.5-2.0 |
300XL | P/N | 1-20 | 0.5-2.0 |
400XL | P/N | 1-20 | 0.5-2.0 |
Bulk density
|
g/cm3 | 2.33 |
---|---|---|
Bending strength
|
MPa | max 300 |
Young's modulus
|
GPa | 190 |
Coefficient of thermal expansion
|
10-6/K | 3.9 |
Thermal conductivity
|
(Room temp.) W/mk | 157 |
Electrical conductivity
|
·cm | 1-20 |
Max. service temperature
|
1300 |