CERASIC, a silicon carbide material sintered under atmospheric pressure, is an ideal material for machine parts that require not only high thermal strength, but also abrasion and corrosion resistance. A range of applications in the semiconductor and FPDs manufacturing process have been developed for this material. In addition, ultra high purity products with a CVD coating are available.
Material for Silicon wafers : Forks, Laping plate, Stage materials, Susceptors, Chucks, Mirrors
Materials for producing FPDs: Large-scale chucks, Sliders
Temperature controllable polishing table
CERASIC Lapping Plate
CERASIC Forks and Plates
| Bulk density | (d) | g/cm3 | 3.1 |
|---|---|---|---|
| Bending strength | (R.T) | MPa | 450 |
| (1450℃) | MPa | 450 | |
| Young's modulus | (E) | GPa | 420 |
| Poisson's ratio | 0.18 | ||
| Shear modulus | (E/d) | 106m | 12.6 |
| Vickers hardness | 2300 | ||
| Fracture toughness | (KIC) | MPa・m1/2 | 3.5 |
| Coefficient of thermal expension | 10-6/K | 4.5 | |
| Thermal conductivity | ( ) |
W/mk | 170 |
| Thermal diffusivity | (/cd) |
cm2/s | 0.8 |
| Thermal shock resistance | (△T) |  |
450 |
| Electrical conductivity | (R.T) |  ·cm |
×100-106 |
